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| INTEGRATED CIRCUITS DATA SHEET TEA1541 SMPS control IC with synchronization function Product specification 2003 Aug 11 Philips Semiconductors Product specification SMPS control IC with synchronization function CONTENTS 1 1.1 1.2 1.3 2 3 4 5 6 6.1 FEATURES Distinctive features Green features Protection features GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Start-up, mains voltage-dependent operation-enabling level and undervoltage lock-out Supply management Primary current regulation Oscillator Demagnetization Minimum and maximum `on-time' Overvoltage protection Overcurrent protection and overpower protection Soft start Winding short-circuit protection Overtemperature protection Burst standby mode Driver 13.2 13.3 13.4 14 15 16 7 8 9 10 11 12 13 13.1 LIMITING VALUES TEA1541 THERMAL CHARACTERISTICS QUALITY SPECIFICATION CHARACTERISTICS APPLICATION INFORMATION PACKAGE OUTLINE SOLDERING Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 6.12 6.13 2003 Aug 11 2 Philips Semiconductors Product specification SMPS control IC with synchronization function 1 1.1 FEATURES Distinctive features 2 GENERAL DESCRIPTION TEA1541 * Universal mains supply operation (70 to 276 V AC) * High-level of integration requiring few external components * Synchronization with internal frequency divider * Frequency independent over-power protection. 1.2 Green features The TEA1541 is a second generation GreenChipTM(1) Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains. A high-level of integration provides a cost-effective power supply requiring only a few external components. The TEA1541 controller enables easy design of highly efficient, reliable switched mode power supplies. Its internal oscillator can be synchronized to pulses from an external signal source. External synchronizing pulses whose frequency is above the SMPS switching frequency range are divided by an internal divider. Special built-in green functions ensure optimum efficiency at all power levels. At low power (standby) levels, the SMPS supply operates at a lower frequency. In burst standby mode, power consumption can be reduced to less than 1 W. The proprietary EZ-HV SOI process allows start-up directly from the rectified mains voltage, avoiding the need for bleeder circuits, and also saves energy. A low voltage BICMOS implements accurate control and high speed protection functions. * Frequency reduction at low power standby for improved system efficiency (<3 W) * Burst mode operation for very low power standby levels (<1 W) * On-chip start-up current source. 1.3 Protection features * Safe restart mode for system fault conditions * Continuous mode protection using demagnetization detection (zero switch-on current) * Accurate and adjustable overvoltage protection * Winding short-circuit protection * Undervoltage protection (foldback during overload) * Overtemperature protection * Adjustable low overcurrent protection (OCP) trip level * Soft (re)start * Mains voltage-dependent operation-enabling level. 3 ORDERING INFORMATION TYPE NUMBER TEA1541P (1) GreenChip is a trademark of Koninklijke Philips Electronics N.V. PACKAGE NAME DIP8 DESCRIPTION plastic dual-in-line package; 8 leads (300 mil) VERSION SOT97-1 2003 Aug 11 3 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 handbook, full pagewidth Vmains CVIN CVCC 1 2 8 7 n.c. Sync pulses TEA1541P 3 4 6 5 RDEM MDB082 Fig.1 Basic application. 2003 Aug 11 4 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 2003 Aug 11 VCC 1 SUPPLY MANAGEMENT mains ok internal UVLO supply start DEM SHORT-CIRCUIT PROTECTION PCS PRIMARY CURRENT SIMULATION Clamp -50 mV IDEM 4 VOLTAGE CONTROLLED OSCILLATOR (frequency information) SYNC. DETECTOR FREQUENCY CONTROL CONTINUOUS MODE PROTECTION 700 mV START-UP CURRENT SOURCE (internal control) 7 HVS 8 VIN S1 GND 2 OCP DEM ICTRL 100 mV OVERVOLTAGE PROTECTION handbook, full pagewidth 4 Philips Semiconductors SMPS control IC with synchronization function BLOCK DIAGRAM 5 (internal control) CTRL 3 SAMPLEAND-HOLD (internal control) OVERTEMPERATURE PROTECTION PCS LOGIC OCP LEB blank Q UVLO BURST CONTROL burst detect MAXIMUM ON-TIME PROTECTION winding shortcircuit 880 mV OVERPOWER PROTECTION R OCP S2 ISS soft start 5 Isense DRIVER 6 DRIVER 3.5 V POWER-ON RESET S TEA1541 (frequency information) (frequency information) Product specification TEA1541 MDB083 Fig.2 Block diagram. Philips Semiconductors Product specification SMPS control IC with synchronization function 5 PINNING SYMBOL VCC GND CTRL DEM PIN 1 2 3 4 DESCRIPTION supply voltage ground control input input from auxiliary winding for demagnetization timing, OVP and overpower protection (OPP) programmable current sense input gate driver output high voltage safety spacer, not connected input for start-up current and mains voltage recognition Fig.3 Pin configuration. handbook, halfpage TEA1541 VCC 1 GND 2 8 7 VIN HVS DRIVER Isense TEA1541P CTRL 3 DEM 4 MDB084 6 5 Isense DRIVER HVS VIN 5 6 7 8 6 FUNCTIONAL DESCRIPTION The TEA1541 is intended as the controller for a compact flyback converter for CRT monitor applications. The IC is situated on the primary side of the output transformer. Output power is determined by the current in the primary winding. The voltage across an auxiliary winding in the transformer is converted to a current by resistor RDEM and used by the IC to derive the current in the primary winding. This winding is also used for continuous mode protection, overvoltage protection, and to power the IC after start-up. The IC can operate in either synchronized or unsynchronized mode. In synchronized mode, the IC synchronizes the converter switching frequency to the monitor line frequency to prevent interference. Line synchronizing pulses are applied to pin CTRL. Each operating cycle of the converter comprises a primary stroke followed by a secondary stroke. During the primary stroke, current flows in the primary winding. The secondary stroke transfers the energy stored in the transformer core to the secondary winding. In either synchronized or unsynchronized mode, the primary stroke only starts at the end of the secondary stroke when the transformer is demagnetized to ensure zero switching primary current. If no synchronizing pulses are present (unsynchronized mode), the IC will operate at its minimum switching frequency. The IC has an internal frequency divider which allows it to operate in synchronized mode at a lower frequency than the synchronizing pulses supplied to pin CTRL by the application. The limited frequency range allows an economical design of the transformer. In unsynchronized mode, when the power that is drawn from the converter decreases, the converter switching frequency also decreases. At very low power (standby) levels, the frequency of the VCO decreases from 25 kHz to the minimum value of approximately 6 kHz as shown by the slope of Fig.4. In a typical application it is possible to obtain an input power of less than 3 W with an output power of 100 mW. 2003 Aug 11 6 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 handbook, halfpage f handbook, halfpage (kHz) 50 synchronized operation 25 M-level VIN VCC(start) unsynchronized operation 6 VCC(trip)(VIN) VCC P(W) VCO variable VCO fixed MDB085 IVIN(max) IVIN(min) IVIN Fig.4 Multi mode operation. ICC MDB087 6.1 Start-up, mains voltage-dependent operation-enabling level and undervoltage lock-out Fig.5 Start-up sequence. Initially, the IC is supplied by the rectified mains voltage at pin VIN. When the voltage at pin VCC is below the VCC voltage for VIN current trip level VCC(trip)(VIN), the supply current drawn from pin VIN, (IVIN) is at the low value IVIN(min). When VCC rises to the VCC(trip)(VIN) level, the current at pin VIN changes to the high value IVIN(max). When the voltage at pin VIN is below the mains voltage-dependent operation-enabling level (M-level), the IC supply capacitor CVCC is charged by the internal start-up current source to approximately 5 V. When the voltage at pin VIN exceeds the M-level, the start-up current source continues to charge CVCC (switch S1 open; see Fig.2). When VCC reaches the start-up voltage level VCC(start), the IC switches to high efficiency (green function) operation by no longer drawing current from pin VIN (see Fig.5). At VCC(start) the IC activates the external MOSFET. When the voltage across the auxiliary winding rises above the voltage across CVCC, the IC supply current will be supplied by the auxiliary winding via pin VCC. If the voltage on pin VCC falls below the VCC undervoltage lock-out level VCC(UVLO), the IC stops switching and enters a safe restart mode in which current to the IC is supplied by the rectified mains voltage via pin VIN, and CVCC is re-charged by the internal start-up current source to VCC(start). 2003 Aug 11 7 Inhibiting the auxiliary supply by external means causes the converter to operate in a stable, well-defined burst mode. This is a burst standby mode that is less efficient than the normal burst standby mode described in section 6.12. If the voltage at pin VIN falls below the mains undervoltage lock-out level MUVLO, a safe restart mode is activated, and the IC stops switching. During normal operation (non-burst standby mode), the duty cycle of the IC, and thus the output power of the supply, is regulated by a control voltage at pin CTRL. If pin VCC is connected to ground, the IC switches to low power standby operation and the start-up current drawn via pin VIN reduces to 400 A (typical). When the voltage on pin VCC rises above 700 mV (typical), the start-up current increases to 1 mA (typical). 6.2 Supply management All internal reference voltages are derived from a temperature compensated, on-chip bandgap. Philips Semiconductors Product specification SMPS control IC with synchronization function 6.3 Primary current regulation TEA1541 The IC uses current mode control for its good line regulation behaviour. The primary current is sensed indirectly via the voltage at pin DEM. The `on-time' of the external MOSFET is controlled by the voltage on pin CTRL which is compared with the internal simulated primary current information. For pin CTRL voltages (VCTRL) between 1 and 1.6 V, the on-time is calculated by the equation: 1.6 - V CTRL t on = PCS x ------------------------------ [ ns ] - I DEM where: * ton: the on-time * PCS: an internal constant which is approximately 0.9. * VCTRL: the voltage on pin CTRL * IDEM: the current drawn from pin DEM during the primary cycle. 6.4 Oscillator f handbook, halfpage (kHz) fsmps(max) fosc fsync (min) fsync (max) 2 x fsync (max) f (kHz) MDB086 Fig.6 Switching frequency as a function of the synchronizing frequency. In synchronized mode, the switching frequency of the SMPS fsmps is controlled by the synchronizing pulses fsync at pin CTRL. Synchronized mode prevents noise disturbance on the CRT monitor screen. Synchronizing pulses whose frequency is outside of the fosc and fsmps(max) window of 26 to 54 kHz are divided by an internal frequency divider. A small frequency hysteresis exists to ensure a stable frequency switch-over. In unsynchronized mode, the system runs at fosc (26 kHz). In unsynchronized mode, at very low power (standby) levels, the frequency of the VCO and consequently the SMPS switching frequency is reduced linearly to its low value of approximately 6 kHz (see Figs 4 and 6). 6.5 Demagnetization The system always operates in discontinuous conduction mode to ensure demagnetization of the output transformer core. A primary cycle only starts when the secondary cycle has ended. Pin DEM protects against an output short-circuit on a cycle-by-cycle basis, by immediately lowering the switching frequency to give a longer off-time and a lower operating power. Demagnetization detection is suppressed automatically at the start of each secondary cycle for a period tsuppr. Suppression of demagnetization detection is necessary for applications where the transformer has a large leakage inductance, at low output voltages and at start-up. If, due to a fault condition, pin DEM is left open circuit, operation of the flyback converter supply immediately stops, and restarts when the fault situation is removed and pin DEM is reconnected. If, during start-up, a fault condition causes pin DEM to be shorted to ground, operation of the flyback converter supply stops after the first cycle, and the IC then begins a restart cycle. This situation continues until the short-circuit is removed. Short-circuit protection is also active at full power to ensure limitation of peak current. 2003 Aug 11 8 Philips Semiconductors Product specification SMPS control IC with synchronization function 6.6 Minimum and maximum `on-time' TEA1541 prematurely due to the false sensing of an overcurrent condition caused by current spikes produced by the discharge of primary-side snubber and parasitic capacitances. The OCP level is adjusted proportionally to the switching frequency such that the product of (Ipeak)2 x frequency stays constant. This arrangement also implements OPP, ensuring that the maximum output power is independent of the switching frequency, otherwise the output power would increase in direct proportion to the switching frequency. 6.9 Soft start The minimum on-time of the converter is not limited by the leading edge blanking time, and therefore can be zero. 1 The IC limits the maximum on-time to -----------f smps where fsmps is the converter switching frequency in either synchronized or unsynchronized mode. If the system requires a longer on-time, a fault condition is assumed, for example, if CVIN is removed, the IC will stop switching and enter the safe restart mode. 6.7 Overvoltage protection The TEA1541 allows OVP to be set accurately. The flyback converter output voltage is accurately represented by the voltage across the auxiliary winding. The auxiliary winding voltage is monitored by the current flowing into pin DEM during the demagnetizing cycle of the transformer. The inevitable voltage spikes at pin DEM are reduced using an internal filter. If the output voltage causes the current into pin DEM to exceed the OVP level lOVP(DEM), the OVP circuit turns off the power MOSFET. The controller then waits until the VCC(UVLO) condition is reached. This is followed by a safe restart cycle, before switching recommences. This process is repeated until the OVP condition ends. The output voltage at which OVP activates, Vo(ovp) is set by the value of resistor, RDEM, (see Fig.8) using the equation: V o(ovp) Ns = ----------- x ( I OVP ( DEM ) x R DEM + V clamp ( DEM ) ( pos ) ) N aux The soft start function allows the transformer peak current to slowly increase at every start-up and restart, to prevent transformer rattle. The soft start function requires a resistor RSS and capacitor CSS to be connected between pin Isense and the sense resistor Rsense (see Fig.7). CSS is charged by an internal current source ISS to V = ISS x RSS, to a maximum of approximately 0.5 V. handbook, halfpage ISS 0.5 V start-up RSS 5 Isense where N is the number of turns on the transformer windings; Vclamp(DEM)(pos) is the positive clamp voltage on pin DEM; reference current IOVP(DEM) is set internally. 6.8 Overcurrent protection and overpower protection Vocp CSS Rsense MBL503 The current in the transformer primary is measured accurately by the internal cycle-by-cycle source current limit circuit using the external sense resistor Rsense. The accuracy of the current limit circuit allows the transformer core to have a minimum specification for the output power required. The OCP circuit limits the `sense' voltage to an internal level, and is activated after the leading edge blanking period, tleb generated by the Leading Edge Blanking circuit (LEB shown in Fig.2). Leading edge blanking is required to inhibit OCP for a short period when the power MOSFET turns on. This ensures that the MOSFET is not turned off 2003 Aug 11 9 Fig.7 Soft start. The rate at which the primary current increases can be adjusted by changing the values of RSS and CSS to change the circuit time constant: = R SS x C SS The maximum primary current is calculated by the V sense ( max ) - ( I SS x R SS ) equation: I primary ( max ) = ----------------------------------------------------------------R sense Philips Semiconductors Product specification SMPS control IC with synchronization function where Vsense(max) is the maximum source voltage for OCP. ISS flows when the voltage on pin Isense is less than approximately 0.5 V. If this voltage exceeds 0.5 V, the soft-start current source starts to limit ISS and completely switches ISS off at VCC(start). Note that ISS is derived from the internal current source supplying charging current to pin VCC. During soft-start, the charging current to pin VCC will be reduced by up to 60 A depending on the value of RSS. 6.10 Winding short-circuit protection TEA1541 period that is longer than the burst standby mode blanking period tblank(burst). During a burst standby mode cycle, the soft-start capacitor CSS, (see Fig.8) is charged to 1.25 V and then discharged via the soft-start resistor RSS. When CSS is discharged to 0.5 V, a soft-restart is initiated. The frequency of a typical 1 burst standby mode cycle is approximately: --------------------------R SS x C SS If, during a burst standby mode cycle, the voltage at pin VCC falls below the trip level voltage VCC(burst), the IC will be supplied again from pin VIN. If VCC(UVLO) is reached within the burst cycle period due to an external load on pin VCC, a restart cycle begins. If during a burst standby mode cycle, the voltage on pin VCC stays above the trip level voltage VCC(burst), a maximum burst efficiency is obtained because the IC is being consistently powered by the auxiliary winding. 6.13 Driver The winding short-circuit protection circuit is activated after the leading edge blanking period. A short-circuit in the transformer winding is detected when the voltage at pin Isense exceeds the winding short-circuit protection voltage Vswp. When a short-circuit is detected, the flyback converter supply will stop switching. When the voltage at pin VCC falls below VCC(UVLO), the IC enters safe restart mode, and capacitor CVCC will recharge via the internal start-up current source supplied from pin VIN until the flyback converter supply restarts at VCC(start). The fault detection and restart cycle will be repeated until the short-circuit is removed. The winding short-circuit protection circuit also provides protection if a diode in the transformer secondary circuit goes short-circuit. 6.11 Overtemperature protection The Gate of the external power MOSFET is driven from a driver circuit having a current sourcing capability of typically 100 mA, and a current sink capability of typically 500 mA. This permits fast turn-on and turn-off of the power MOSFET for efficient operation. A low driver source current has been chosen in order to limit the V/t at switch-on. This reduces Electro Magnetic Interference (EMI) and also limits the voltage spikes across the current sense resistor Rsense. An accurate temperature protection circuit stops the converter from switching if the IC junction temperature exceeds the maximum temperature protection level Tprot(max). When the voltage at pin VCC falls below VCC(UVLO), the IC enters safe restart mode, and capacitor CVCC will recharge to VCC(start) via the internal start-up current source derived from pin VIN. If the temperature is still too high, the voltage at pin VCC will fall again to VCC(UVLO). This cycle is repeated until the junction temperature falls 8 degrees (typical) below Tprot(max). 6.12 Burst standby mode Pin CTRL and pin Isense are also used to implement the burst standby mode feature. In burst standby mode, the converter consumes less than 1 W (typical) of input power at a maximum output power of 100 mW. This power is sufficient to supply a low power device such as a microcontroller. Burst standby mode is entered when a current larger than the burst standby mode active current Iburst is forced into pin CTRL, via the opto-coupler, for a 2003 Aug 11 10 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 7 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground (pin 2); positive currents flow into the chip; pin 1 is not allowed to be current driven. The voltage ratings are valid provided other ratings are not being violated; current ratings are valid provided the maximum power rating is not violated. SYMBOL VCC VCTRL VDEM Vsense VVIN ICTRL IDEM Isense IDRIVER IVIN Ptot Tstg Tj Vesd PARAMETER voltage on pin VCC voltage on pin CTRL voltage on pin DEM voltage on pin Isense voltage on pin VIN current on pin CTRL current on pin DEM current on pin Isense current on pin DRIVER current pin VIN total power dissipation storage temperature junction temperature electrostatic discharge; human body model; note 1 machine model; note 2 Notes 1. Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. 2. Equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 resistor. 8 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) 9 PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 100 UNIT K/W pins 1 to 6 (class II) pin 8 (Vin) (class I) - - - 2000 1250 200 V V V Tamb < 70 C < 10% < 10% current limited current limited CONDITIONS continuous MIN. -0.4 -0.4 -0.4 -0.4 -0.4 - -250 -1 -0.8 - - -55 -20 +5 - - +550 50 +250 +10 +2 +5 0.75 +150 +145 MAX. +40 V V V V V mA A mA A mA W C C UNIT QUALITY SPECIFICATION In accordance with "SNW-FQ-611 part D". 2003 Aug 11 11 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 10 CHARACTERISTICS Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT A V mA A Start-up current source (pin VIN) IVIN(min) VCC(VIN)trip IVIN(max) IVIN minimum supply current drawn from pin VIN VCC < VCC(trip)(VIN), VVIN > 100 V 300 0.5 1.25 - 400 0.75 1.6 100 500 1.0 1.95 300 supply voltage for pin VIN current trip VVIN > 100 V level maximum supply current drawn from pin VIN supply current drawn from pin VIN VCC = 10 V; VVIN > 100 V after start-up; VCC > VCC(start); VVIN > 100 V Vbd M-level MUVLO breakdown voltage mains-dependent operation-enabling level mains undervoltage lock-out level 550 33 25 - 37 28.5 - 40 33 V V V VCC management (pin VCC) VCC(start) VCC(UVLO) VCC(hys) ICC(h) ICC(l) start-up voltage undervoltage lock-out hysteresis voltage charging current (high) charging current (low) VCC(start) - VCC(UVLO) VVIN > 100 V; VCC < VCC(trip)(VIN) VVIN > 100 V; VCC(trip)(VIN) < VCC < VCC(UVLO) 10.8 8.5 2.1 - -1.6 11.4 9.0 2.4 -0.25 -1.2 12 9.5 2.7 - -0.75 V V V mA mA ICC(restart) ICC(oper) restart current supply current under normal operation VVIN > 100 V; VCC(UVLO) -1.25 < VCC < VCC(start) no load on pin DRIVER - -1.0 1.6 -0.75 - mA mA Primary current simulation PCS Vth(DEM) Iprot(DEM) Vclamp(DEM)(neg) Vclamp(DEM)(pos) tsuppr Vsc(prot)(DEM) primary current simulation factor - 70 -50 I(DEM) = -150 A I(DEM) = 250 A -0.5 0.55 1.1 -90 0.9 - 130 -10 -0.05 0.85 1.9 -10 A.s/V Demagnetization management (pin DEM) demagnetization comparator threshold voltage demagnetization current negative clamp voltage positive clamp voltage suppression time of transformer ringing at start of secondary stroke short-circuit protection voltage 100 - -0.25 0.7 1.5 -50 mV nA V V s mV 2003 Aug 11 12 Philips Semiconductors Product specification SMPS control IC with synchronization function SYMBOL Pulse width modulator ton(min) ton(max) Oscillator fosc(min) fosc fsmps(max) fsmps(hys) Vvco(start) Vvco(max) minimum oscillator frequency oscillator frequency maximum SMPS switching frequency before frequency division frequency hysteresis for division voltage on pin CTRL where frequency reduction starts peak voltage on pin CTRL where frequency is equal to fosc(min) minimum voltage on pin CTRL for maximum duty cycle maximum voltage on pin CTRL for minimum duty cycle current on pin CTRL VCTRL > 1.5 V; no sync VCTRL < 1.5 V; no sync; note 2 sync. on; note 3 sync. on sync off sync off - 24 - - 1.38 - 6 26 54 4 1.46 1.58 minimum on-time maximum on-time latched - - 0 1/fsmps PARAMETER CONDITIONS MIN. TYP. TEA1541 MAX. - - - 28 - - 1.54 - UNIT s kHz kHz kHz kHz V V Duty cycle control (pin CTRL) VCTRL(min) VCTRL(max) Iprot(CTRL) Vth(burst)(on) Iburst tblank(burst) Vch(sense)(burst) Vdis(sense)(burst) Ich(sense)(burst) VCC(burst) - - -0.6 Iburst = 4 mA - 4 25 - - - - 1.0 1.6 -0.8 3.6 7 32 1.25 0.5 100 11.2 - - -1.0 - 11 40 - - - - V V A V mA s V V A V Burst standby mode (pin CTRL) burst standby mode active threshold voltage burst standby mode active current burst standby mode blanking time charge voltage on pin Isense in burst standby mode discharge voltage level on pin Isense in burst standby mode charging current into pin Isense in burst standby mode supply voltage trip level for supply from pin VIN during burst standby mode supply current during burst standby mode ICC(burst) - 600 - A Synchronization (pin CTRL) Vsync V/tsync synchronization recognition voltage synchronization recognition 0.37 - 0.52 0.5(1) 0.65 - V V/s 2003 Aug 11 13 Philips Semiconductors Product specification SMPS control IC with synchronization function SYMBOL PARAMETER CONDITIONS MIN. TYP. TEA1541 MAX. UNIT Overcurrent and winding short-circuit protection (pin Isense) Vsense(max) maximum source voltage for OCP fsmps(min); V/t = 0.1 V/s fsmps(max); V/t = 0.1 V/s tPD Vswp tleb Iss Vss(max) IOVP(DEM) propagation delay from detecting Vsense(max) to switch-off winding short-circuit protection voltage blanking time for current and winding short-circuit protection soft start current soft start maximum sense voltage Vsense < 0.5 V V/t = 0.5 V/s V/t = 0.5 V/s 0.48 0.33 - 0.83 320 45 0.45 0.52 0.37 140 0.88 380 60 0.50 0.56 0.41 185 0.96 480 75 0.55 V V ns V ns A V A Overvoltage protection (pin DEM) OVP trigger current see Section 54 "Overvoltage protection" - - 400 - 130 - 60 66 Driver (pin DRIVER) Isource Isink source current capability of driver sink current capability of driver VCC = 9.5 V; VDRIVER = 5 V VCC = 9.5 V; VDRIVER = 5 V VCC = 9.5 V; VDRIVER = 9.5 V Vo(driver)(max) Tprot(max) Tprot(hys) Notes 1. Guaranteed by design. 2. This is also the minimum SMPS switching frequency in synchronized mode. 3. This is also the maximum oscillator frequency in synchronized mode. maximum output voltage of driver VCC > 12 V Temperature protection maximum temperature protection level hysteresis for the temperature protection level 140 8 150 - C C -100 500 700 11.5 -75 - - 12 mA mA mA V 2003 Aug 11 14 Philips Semiconductors Product specification SMPS control IC with synchronization function 11 APPLICATION INFORMATION A typical flyback converter that uses the TEA1541 consists of an input filter, a transformer with a third (auxiliary) winding, and an output stage with a feedback circuit. Capacitor CVCC connected to pin VCC buffers the IC supply voltage from the rectified high voltage (AC) mains during start-up, or from the auxiliary winding during operation. Resistor Rsense converts the primary current into a voltage at pin Isense. The resistor value defines the maximum primary peak current. Resistor RSS and capacitor CSS enable soft start and burst standby mode operation. TEA1541 A resistor and a series diode can be placed in parallel with resistor RDEM to control the amount of current flowing into, and out of the IC, allowing the values of the OVP level and primary current simulation to be defined independently. More details are available in Application note AN10205. handbook, full pagewidth Vmains CVIN CVCC RSNUB DSNUB CSNUB DOUT COUT VCC GND CSYNC Sync RSYNC CREG CSS RREG RDEM Rsense CTRL DEM 1 2 3 4 8 VIN OUTPUT TEA1541P 7 HV 6 5 DRIVER Isense RSS power MOSFET DVCC OPTO RREG1 MDB081 RREG2 Fig.8 Flyback configuration with synchronization and soft start. 2003 Aug 11 15 Philips Semiconductors Product specification SMPS control IC with synchronization function 12 PACKAGE OUTLINE DIP8: plastic dual in-line package; 8 leads (300 mil) TEA1541 SOT97-1 D seating plane ME A2 A L A1 c Z e b1 wM (e 1) b2 5 MH b 8 pin 1 index E 1 4 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 2003 Aug 11 16 Philips Semiconductors Product specification SMPS control IC with synchronization function 13 SOLDERING 13.1 Introduction to soldering through-hole mount packages TEA1541 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.3 Manual soldering This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 13.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. 13.4 Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING WAVE suitable(1) not suitable DBS, DIP, HDIP, SDIP, SIL PMFP(2) Notes suitable - 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable. 2003 Aug 11 17 Philips Semiconductors Product specification SMPS control IC with synchronization function 14 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION TEA1541 This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 15 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 16 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2003 Aug 11 18 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2003 SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403502/01/pp19 Date of release: 2003 Aug 11 Document order number: 9397 750 10696 |
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